发明名称 Electrical signal transmitting arrangement between a thermally isolated module on carrier plate and adjacent neighbouring modules
摘要 The arrangement includes signal lines (L1,L2;L3,L4;L5,L6,L7) for a thermally isolated module (M1) which is cooled or heated from the lower surface of a base plate (1). At least an adjacent module (M2,M3) is provided on the lower surface of the base plate (1,5,7) and has an electrically conducting bearing (6,8). An electrical field is formed between the signal lines. The lower surface of the base plate is electrically and thermally isolated from the adjacent electrically conducting bearings. An electrically conducting bearing (3) is provided in the area of the first module on the lower surface of the base plate and is separated from the bearings of the adjacent modules. The signal lines (L1,L2;L3,L4) are connected electrically.
申请公布号 EP0915515(A2) 申请公布日期 1999.05.12
申请号 EP19980118503 申请日期 1998.09.30
申请人 SIEMENS AKTIENGESELLSCHAFT 发明人 WEISKE, CLAUS-JOERG
分类号 H01L23/38;H01L23/66;H05K1/02;H05K1/14 主分类号 H01L23/38
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