发明名称 |
Thin power tape ball grid array package |
摘要 |
An integrated circuit package includes a heat-spreader which is formed to have a centrally disposed recessed portion between planar surfaces, and flex tape extending from the planar surfaces into the centrally disposed surface. A semiconductor chip is mounted on the centrally disposed surface between the flex tape, and wire bonds interconnect bonding pads on the chip to the metal interconnect patterns on the flex tape. Plastic molding or epoxy is then applied to encapsulate the chip and wire bonding in the centrally disposed planar surface of the heat spreader. The package is then readily mounted on a motherboard using solder balls. <IMAGE> |
申请公布号 |
EP0880175(A3) |
申请公布日期 |
1999.05.12 |
申请号 |
EP19980303039 |
申请日期 |
1998.04.21 |
申请人 |
LSI LOGIC CORPORATION |
发明人 |
CHIA, CHOK J.;VARIOT, PATRICK;ALAGARATNAM, MANIAM |
分类号 |
H01L23/29;H01L21/60;H01L23/12;H01L23/24;H01L23/31;H01L23/36;H01L23/498 |
主分类号 |
H01L23/29 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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