DEVICE FOR APPLYING BOND OR THE LIKE TO ELECTRONIC PARTS

摘要

PROBLEM TO BE SOLVED: To provide a device for applying bond or the like which can partially apply a bond or the like to one surface of electronic parts with high accuracy with less variation and can reduce the used amount of the bond or the like. SOLUTION: A device for applying bond or the like is provided with a stage 2 having a grooves 2a on its upper surface and sections 2b and 2c for applying bond or the like on both sides of the groove 2a and a blade 3 which is provided so that the blade may be moved in the longitudinal direction of the groove 2a and the blade 3 has a blade main body 3a on which sections 3b and 3c for smoothing bond or the like which are brought into contact with the surfaces 2b and 2c of the stage 2 on both sides of the groove 2a and a Russell-like projection 6 which is integrally formed with the main body 3a and put in the groove 2a.