| 摘要 |
PROBLEM TO BE SOLVED: To obtain a resin composition for sealing semiconductor, designed to maintain physical properties and moldability in an excellent state, achieve the flame resistance of the UL94-V0 grade, and further achieve the reliability at the level of an epoxy resin sealing material under a moist condition. SOLUTION: This resin composition for sealing semiconductor comprises a straight chain type polyarylene sulfide resin, a polystyrene-based resin mainly having a syndiotactic structure, an olefinic copolymer comprising anα-olefin andα,β-unsaturated glycidyl ester, a graft copolymer having chemically bonded one or more kinds of the copolymers composed of repeating units of the formula [R is hydrogen or a lower alkyl group; X is one or more kinds of groups selected from COOCH3 , COOC2 H5 , COOC4 H9 , COOCH2 CH(C2 H5 )C4 H9 , C6 H5 and CN] so as to form a branched or a cross-linked structure, an inorganic filler, an inorganic ion exchanger, and a flame retardant.
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