| 摘要 |
PROBLEM TO BE SOLVED: To eliminate the defective joining developed, by which crushed quantity of plural solder bumps is different in a single semiconductor element, by analyzing both temp. histories of the front part and the rear part in the advancing direction in plural solder bumps of the single semiconductor element for package at the time of setting the conditions in a reflow furnace. SOLUTION: The temps. at the front part and the rear part in the shifting direction of the solder bump for fixing the semiconductor are obtd. with a temp. analysis in a step 101. The setting condition is changed in a step 102 and the reanalysis of the temp. is executed in the step 101. The temp. analyses are executed in several times and thereafter, the condition in the reflow furnace is changed in a step 103. From the temp. analyzed result obtd. with the step 101, either one of the condition, in which the difference of time exceeding the melting temp. of the solder in the temps. of the solder bumps at the front part and the rear part is little, or the condition, in which the difference of time reaching the melting temp. of the solder in the temps. of the solder bumps at the front part and the rear part, is selected to set the condition of the reflow furnace based on the condition changed in the step 102. |
