| 摘要 |
PROBLEM TO BE SOLVED: To increase the processing speed, and to improve the efficiency of polishing work, by increasing the rotational frequency in a surface polishing device. SOLUTION: This surface polishing device is composed of a rotary surface plate 12, a polishing head, a polishing cloth compression mechanism 31, and the like. A polishing cloth 11 is installed on the surface of the rotary surface plate 12. The polishing head is composed of a holding plate 15, a main spindle, a pressure mechanism, a rotating mechanism, and the like. A wafer 10 is held at the lower surface of the holding plate 15. The polishing cloth compression mechanism 31 is composed of a ring form of pressing part 33 provided along the outer periphery of the holding plate 15, a ring form of supporting frame 34 to support the pressure part 33 from the back surface side, and the like. The pressure part 33 is the area along the outer periphery of the wafer 10, and it compresses the polishing cloth 11 from the upper side, by contacting to the surface of the polishing cloth 11 around the wafer 10. |
