| 摘要 |
PROBLEM TO BE SOLVED: To enable optimum load to be applied to a mold regardless of deformation of the mold in an equipment for sealing semiconductor devices with resin. SOLUTION: An upper mold 12 is provided with load detectors 18 (18-1 and 18-2), and a load applied from a lower mold 13 to the upper mold 12 is detected by the load detectors 18 and then transferred to a control section 17. In the control section 17, when the detected load is out of bounds of load reference, an indicated value of a load reference value is modified so that the detected load is within bounds of preset load reference, and a control signal for applying a load of the indicated value is transferred to a motor 15. |
