| 摘要 |
PROBLEM TO BE SOLVED: To provide a 3-dimensional circuit assembly wherein high mounting density is realized with low-cost materials. SOLUTION: A second flexible film 18 is connected to a conductive path of a first flexible film 18, with a connection part, wherein the first film 16 is connected electrically to the second film 18 at completion time. First and second flexible films 16 and 18 are so placed in an open mold 10 that the first film 16 covers the second film 18 for an electrical connection path so as to adjoin an electrical connection part. A plastic material is injected to adjoin at least one surface of the first or second film. A molten plastic is bonded to the second flexible film 18 to form a consolidated supporting structure. Owing to the heat in a melting process and compatibility of the materials, the second film 18 is fixed to the first film 16 to form a circuit assembly. After the plastic material has cooled sufficiently, a mold 10 is opened and the circuit assembly is removed. During or after the molding process, a circuit layer is mutually connected with a conductive medium. |
