发明名称 |
Method and apparatus for establishing a solder bond to a solder ball grid array |
摘要 |
Apparatus and method for establishing a solder bond between a solder ball grid array and a circuit mounted on a substrate includes a bonding tool having a bonding tip for applying heat to the site of one or more of the solder balls in the solder ball grid array, a transducer for measuring displacement of the bonding tip during the bonding operation, and a signal generator responsive to the transducer for providing a signal indicative of tip displacement. The signal generated by the signal generator may be fed back to the bonding tool to optimize bonding parameters.
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申请公布号 |
US5902495(A) |
申请公布日期 |
1999.05.11 |
申请号 |
US19960734934 |
申请日期 |
1996.10.22 |
申请人 |
INTERNATIONAL BUSINESS MACHINES CORPORATION |
发明人 |
BURKE, EDWARD J.;HENDERSON, DONALD WESLEY;LEHMAN, LAWRENCE PHILIP;WEBSTER DANIEL C. |
分类号 |
B23K1/00;B23K3/02;B23K3/03;H05K3/34;(IPC1-7):B23K1/00 |
主分类号 |
B23K1/00 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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