| 摘要 |
PROBLEM TO BE SOLVED: To provide a method by which a highly reliable, inexpensive, and simple supporting spring with wiring pattern which has a uniform thickness and spring property and can float an MR (magneto-resistive head) mounting section in a uniform attitude and from which the position of the wiring pattern is not deviated. SOLUTION: After an SUS (stainless steel) pattern 2 is formed by punching a double-sided substrate composed of copper foil 7, polyimide 8, and SUS foil 9 (201), dry films 3 are respectively laminated upon both surfaces of the pattern 7 (203). Then, after a copper wiring pattern 4 is formed by exposing, developing, and etching the dry films 3, the dry films 3 are stripped off and the polyimide 8 is removed from prescribed parts (204). After removing the polyimide 8, dry films 3 are again laminated upon the pattern 2 (205) and Ni/Au plating 10 is performed on the copper wiring pattern 4 (206). Then a polyimide-based resin 11 is applied to the pattern 4. Finally, a supporting spring with wiring pattern is manufactured by removing the dry films 3 (208) and the supporting spring thus manufactured becomes a product after appearance inspections and characteristic evaluation (209). |
