METAL EVAPORATED OPTICAL FIBER ARRAY MODULE

摘要

PROBLEM TO BE SOLVED: To improve the tension characteristic on a surface which may be easily subjected to sectional polishing after packaging of optical fibers and is adhered by pressing to spread the section of arrayed optical fibers at the time of adhering and fixing the optical fibers to an optical waveguide element. SOLUTION: This optical fiber array module includes an optical fiber array 120 which is deposited with a metal by evaporation on its surface, an array substrate 100 which is formed with aligning grooves 110 to be packaged with the optical fiber array 120, is deposited with the metal by evaporation on the upper part inclusive of the aligning grooves 110 and is joined with the aligning grooves 110 and the optical fiber array 120 packaged in the aligning grooves 110 via the metal as a medium and a cover body 130 which protects and fixes the optical fiber array 120 packaged in the aligning grooves 110 of the array substrate 100. The optical fiber array module described above preferably has further a plane substrate joined to the array substrate 100 while the optical fiber array 120 packaged in the array substrate 100 including the holes to be inserted with the optical fiber array 120 is held inserted into these holes.