| 摘要 |
<p>PROBLEM TO BE SOLVED: To avoid problems, i.e., positional shift of solder ball at the time of reflow and defective bonding, when solder balls are mounted in a BGA package. SOLUTION: This semiconductor device comprises an insulating board 3 having a plurality of via holes 3a for exposing a part of a conductor pattern formed on one surface to the other side face thereof. A connection terminal, i.e., a conductive ball 7b is bonded to the conductor pattern through a conductive paste 7a filling the via hole 3a. Since the conductive paste 7a has a melting point higher than the that of conductive ball 7b, the conductive ball 7b begins to fuse earlier than the conductive paste 7a, and then the conductive paste 7a begins to fuse after a time lag. Gas generated through boiling of flux in the conductive paste 7a passes through already molten conductive balls 7b and discharged to the outside, thus avoiding positional shift of solder ball and defective bonding.</p> |
