发明名称 |
Method of forming assemblies of circuit boards in different planes |
摘要 |
A method of forming a circuit board with electronic assemblies lying in different planes, includes providing a single circuit board with entire electronic assemblies pressed thereon. A channel is then formed in the circuit board of a predetermined depth to divide the circuit board into two separate, but integral portions. The circuit board is then bent at a point between the first and second portions of the circuit board such that the second portion of the circuit board can be bent between 0 and 180 degrees with respect to the first portion of the circuit board.
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申请公布号 |
US5903440(A) |
申请公布日期 |
1999.05.11 |
申请号 |
US19980016782 |
申请日期 |
1998.01.30 |
申请人 |
DELCO ELECTRONICS CORPORAITON |
发明人 |
BLAZIER, MICHAEL WAYNE;STEPHAN, FRANK MARTIN |
分类号 |
H05K1/00;H05K3/00;(IPC1-7):H05K7/02 |
主分类号 |
H05K1/00 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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