| 摘要 |
<p>PROBLEM TO BE SOLVED: To provide a semiconductor device, where the outer jointing edge of an electrode terminal and the upper surface of a lid are parallel with each other, and the outer jointing edge is superior in positional accuracy. SOLUTION: A semiconductor device is equipped with a case 5, which is possessed of an open upside and houses a semiconductor element 8, a lid which closes the opening of the case 5, and electrode terminals 3 fixed to the case 5. The lid is provided with terminal insertion holes which penetrate through it from below to the upside, the electrode terminals 3 are inserted into the terminal insertion holes and pulled up from the upside of the lid, and the outer jointing edges 3a of the pulled electrode terminals 3 are bent to joint the lid to the case 5. The lid is possessed of projections 9 adjacent to the tips of the electrode terminals 3 located on its surface, and the projection's hook with a turnup is set as high as the tip of the electrode terminal 3, when the outer jointing edge 3a is bent.</p> |
