| 摘要 |
PROBLEM TO BE SOLVED: To eliminate adverse effects in radiation caused by a shield case, along with low cost in a manufacturing step. SOLUTION: Electronic parts, such as infrared LED element, photodiode, and integrated circuit, are mounted on a circuit board 2. A communication module is sealed by transparent sealing resin 7 (epoxy resin), in a way that the upper parts of the infrared LED element and the photo-diode are covered with semispherical lens parts 7a and 7b. An Ni-plating layer 21 is formed on all the surfaces of the sealing resin 7 except for the semispherical lens parts 7a and 7b and a through-hole electrode. The Ni-plating layer 21 on the surface of the sealing resin is connected to the GND in a way such that the part of the Ni-plating layer 21 is welded by solder 10 to a GND electrode 9 on the mounting board (motherboard) side. In this way, without using a sealed case, the cost of parts, assembling hours or testing hours are reduced, reliability in sealing and in radiating effect by the Ni-plating layer are improved, and at the same time a small thin module is obtained. |
