发明名称 MANUFACTURE OF PACKAGE FOR OPTICAL COMMUNICATION
摘要 PROBLEM TO BE SOLVED: To reduce the production cost of a frame and a ring, which constitutes a package for optical communication by a method wherein a hollow round pipe is formed into a square pipe shape, the square pipe is cut in a prescribed length, and a holder insertion part and a ceramic board fitting part are formed in the cut pipe to produce the frame. SOLUTION: In the production process of a frame 3, first a hollow and long round pipe 21 with a circular section is prepared and is formed into a square pipe 22 with a quadrangular section by a cold strip method or the like, for example. The pipe 22 is cut in a prescribed size, a holder insertion part 4 for inserting a holder, a board fitting part 24 for mounting a ceramic board and the like are formed by processing in the cut pipe and the frame 3 is produced. As a result, the frame 3 constituting a package for optical communication can be produced at extremely low cost as compared to that in the case, where the frame 3 is produced by a conventional wire cutting method. Accordingly, the overall production cost of the package optical communication can be significantly reduced.
申请公布号 JPH11126840(A) 申请公布日期 1999.05.11
申请号 JP19970307924 申请日期 1997.10.21
申请人 SUMITOMO METAL SMI ELECTRON DEVICES INC 发明人 NARUSHIGE KEIJI
分类号 H01L23/02;H01L33/58 主分类号 H01L23/02
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