发明名称 PROCEDE DE DECOUPLAGE D'UN BRIN MULTIFILAMENTAIRE SUPRACONDUCTEUR HTC A MATRICE A BASE D'ARGENT, ET BRIN MULTIFILAMENTAIRE AINSI REALISE
摘要 In a multi-filament high temperature superconductor (HTSC) wire, each filament comprises a HTSC ceramic core (11) enclosed by a first Ag alloy sheath (12) which, in turn, is surrounded by an oxygen-permeable non-superconductive ceramic layer (13) enclosed by a second Ag alloy sheath (14). Also claimed is a process for producing the above wire, involving filling a silver-based sleeve with HTSC precursor powders, drawing to a monofilament wire, cutting the wire into lengths, filling a second silver-based sleeve with the cut lengths, drawing the resulting multi-filament billet to a multi-filament wire, repeating the above cutting and drawing steps at least once and then shaping and heat treating the multi-filament wire. The novelty comprises: (a) preparing a multilayer composite material consisting of one or more silver-based foils and one or more oxygen-permeable non-superconductive ceramic layers; and (b) interposing the multilayer material between first and second silver-based l ayers to form the first silver-based sheath used to produce the monofilament wire.
申请公布号 FR2761516(B1) 申请公布日期 1999.05.07
申请号 FR19970003752 申请日期 1997.03.27
申请人 ALCATEL ALSTHOM COMPAGNIE GENERALE D'ELECTRICITE 发明人 DUPERRAY GERARD;GRIVON FERNAND;HERRMANN PETER FRIEDRICH
分类号 C01G1/00;C01G5/00;C01G29/00;H01B12/10;H01B13/00;H01L39/14;(IPC1-7):H01B12/10 主分类号 C01G1/00
代理机构 代理人
主权项
地址