| 摘要 |
The present invention relates to supported polycrystalline diamond compact cutters (PDC cutters) made under high temperature, high pressure (HT/HP) processing conditions, and more particularly to supported PDC cutters having non-planar cutting surfaces. More specifically, the present invention is for an oriented PDC cutter (10) wherein chips and debris (16) are funneled away from the cutting edge (18) by the edges (20) of a raised top surface (14) of the polycrystalline diamond layer (PCD layer). The redirection of the debris is achieved by the creation of high and low regions on the PCD layer, of which there can be a variety of different surface geometries. Thus, an object of the present invention is to provide a PDC cutter with improved performance through channeling debris away from its cutting edge. <IMAGE> |
