| 摘要 |
The identification element is connected to the integrated circuit, which is a non-encapsulated chip (5), and an antenna coil (1,2) which comprises at least one layer of a metallic coating. The antenna coil is constructed to form a resonant circuit, and the chip is connected to the antenna coil by contacting method employed in semiconductor production. The antenna coil makes a major contribution to the total capacitance, while only a minor part of the capacitance, while only a minor part of the capacitance originates from the chip (integrated circuit). The Q-factor of the resonant circuit is high, at least higher than 50, and the capacitance is higher than 1 nF. An additional capacitance is provided that stores an amount of energy sufficient to activate the chip as and when required. |
