发明名称 Liquid cooler for power semiconductor components
摘要 Each pipe (2) contains a torsionally fixed spiral (3) whose outer dimension of turns is the same as the inner contour of the pipes. Each spiral is longer than the pipes formed in the cooler body (1). The spiral is made of wire of the same material as the cooler body, with wire thickness amounting to 20 to 30 per cent of the spiral diameter. The spiral turns are equidistant with spacing equaling to the spiral diameter.
申请公布号 DE19747321(A1) 申请公布日期 1999.05.06
申请号 DE1997147321 申请日期 1997.10.27
申请人 SEMIKRON ELEKTRONIK GMBH, 90431 NUERNBERG, DE 发明人 SCHMIDT, RAINER, 90473 NUERNBERG, DE;ULLRICH, FRANZ, 90571 SCHWAIG, DE
分类号 H01L23/473;(IPC1-7):H01L23/473 主分类号 H01L23/473
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