VIA PAD GEOMETRY SUPPORTING UNIFORM TRANSMISSION LINE STRUCTURES

摘要

A connector (400) for coupling high frequency signals between devices includes a substrate having an array of vias (410) for coupling a reference voltage to reference voltages traces (460) that extend along the substrate surface between the devices. Signal traces (430) including device pads (434) for coupling signals to and from the devices alternate with the reference voltage traces (460). The widths of the reference voltage traces (460) are varied to maintain a substantially constant separation between the reference voltage trace (460) and an adjacent signal trace (430).