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发明名称
Method for thinning a semoiconductor wafer
摘要
<p>Prior to the thinning process, a top covering of resin and foil is added, and then the side face is cut straight before the thinning process is carried out, wherein grinding of wafer is carried out perpendicular to its thickness.</p>
申请公布号
EP0913858(A1)
申请公布日期
1999.05.06
申请号
EP19980410127
申请日期
1998.10.30
申请人
STMICROELECTRONICS SA
发明人
VANDEPUTTE, JACQUES
分类号
B24B9/06;B24B1/00;H01L21/304;(IPC1-7):H01L21/304
主分类号
B24B9/06
代理机构
代理人
主权项
地址
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