发明名称 EPOXY RESIN MIXTURES FOR PREPREGS AND COMPOSITES
摘要 <p>PCT No. PCT/DE95/01135 Sec. 371 Date Mar. 10, 1997 Sec. 102(e) Date Mar. 10, 1997 PCT Filed Aug. 25, 1995 PCT Pub. No. WO96/07684 PCT Pub. Date Mar. 14, 1996Epoxy resin mixtures for prepregs and composites Epoxy resin mixtures for preparing prepregs and composites contain the following components: a phosphorus-modified epoxy resin with an epoxy value of 0.02 to 1 mol/100 g, made up of structural units derived from (a) polyepoxy compounds with at least two epoxy groups per molecule and (b) phosphinic acid anhydrides, phosphonic acid anhydrides, or phosphonic acid half-esters; a glycidyl group-free compound with phenolic OH groups in the form of bisphenol-A, bisphenol-F, or a high-molecular phenoxy resin obtained through the condensation of bisphenol-A or bisphenol-F with epichlorohydrin; an aromatic polyamine used as a hardening agent.</p>
申请公布号 EP0779904(B1) 申请公布日期 1999.05.06
申请号 EP19950928983 申请日期 1995.08.25
申请人 SIEMENS AKTIENGESELLSCHAFT 发明人 VON GENTZKOW, WOLFGANG;HUBER, JUERGEN;KAPITZA, HEINRICH;ROGLER, WOLFGANG
分类号 C08J5/10;B32B27/38;C08G59/14;C08G59/20;C08G59/30;C08G59/50;C08J5/24;C08L63/00;H01L23/498;H05K1/03;(IPC1-7):C08G59/30;H01L23/14 主分类号 C08J5/10
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