| 摘要 |
<p>A plurality of silicon and GaAs wafers (32) each including integrated circuitry for providing particular functions for each wafer are mounted within a housing (19) in a stacked, spaced apart, and parallel configuration. Photodetectors and LED's are used to transmit and receive data between opposing wafers. In this manner a micro-packaged device or system is obtained for use amongst other things in microsatellites (2).</p> |
