Semiconductor pressure sensor

摘要

In order to decrease a resistance component of lead portion (41 - 44) of a pressure sensor, surfaces of the lead portions other than gauge portions (31 - 34), and pad portions (51 - 54) of the pressure sensor are coated directly with a metallic thin film such as aluminum, or at least an acceptor impurity such as boron, potassium, phosphorus, antimony or arsenic, is doped into the lead portions (41 - 44) and the pad portions (51 - 54). <IMAGE>