发明名称 |
FLEXIBLE IC MODULE AND METHOD OF ITS MANUFACTURE, AND METHOD OF MANUFACTURING INFORMATION CARRIER COMPRISING FLEXIBLE IC MODULE |
摘要 |
There are provided a flexible IC module utilizable for the production of contactless IC cards and a method for producing an information carrier using the flexible IC module. An IC chip 1 and a coil 2 are embedded in a flexible substrate 3 comprising a nonwoven fabric or the like having compressibility in the thickness direction, self-pressure bonding property and resin impregnation property. This flexible IC module is produced in the following procedure. 1 &cir& A first nonwoven fabric 12 having compressibility in the thickness direction, self-pressure bonding property and resin impregnation property is placed on a bottom force 11. 2 &cir& An IC chip and a coil are placed on the first nonwoven fabric after positioning them. 3 &cir& A second nonwoven fabric 13 is superposed on the IC chip and coil. 4 &cir& A top force 14 is pressed onto the second nonwoven fabric, and the first and second nonwoven fabrics, the IC chip and the coil are integrated by hot pressing. <IMAGE> |
申请公布号 |
EP0913268(A1) |
申请公布日期 |
1999.05.06 |
申请号 |
EP19980919640 |
申请日期 |
1998.05.18 |
申请人 |
HITACHI MAXELL, LTD. |
发明人 |
KOHAMA, KYOICHI;HIRAI, YUSUKE;TAMADA, KANAME;SUEYOSHI, TOSHINOBU;FUKAO, RYUZO;DAIDO, KAZUHIKO |
分类号 |
G06K19/077;H05K1/03;H05K1/18 |
主分类号 |
G06K19/077 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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