Semiconductor component is produced with high circuit complexity to hinder piracy and manipulation

摘要

A semiconductor component is produced by forming conductive vias through the component layers into the substrate (1), forming the contact (0c) between the component and the vias, bonding the substrate (1) to a second substrate (6), thinning the first substrate (1) until the vias are exposed and then producing a conductive structural element (9) on the first substrate free surface and in electrical contact with the vias. Production of a semiconductor component having one or more conductive structural elements comprises (a) applying and structuring component layers (3, 4) on a substrate (1); (b) forming conductive vias extending through all the component layers and down into the substrate (1); (c) effecting a functional electrical contact (0c) between the component and the conductive material in the vias; (d) bonding the substrate (1) to a second substrate (6); (e) thinning the first substrate (1) until the vias are exposed; (f) producing the or one of the conductive structural elements (9) on the free surface of the first substrate such that the element (9) is in electrical contact with the conductive material in the vias; and (g) finishing the component. Independent claims are also included for (i) a semiconductor component produced by the above process; and (ii) a semiconductor component produced by the above process and which is protected against the environment preferably by applying a protective layer prior to step (f).