发明名称 HEAT-SETTING SINGLE-COMPONENT LVA (LOW-VISCOSITY ADHESIVE) SYSTEM FOR BONDING IN THE MICRO-RANGE
摘要 The invention relates to a single-component adhesive system that consists at least of a casting resin, in particular of an epoxy casting resin, and a multivalent alcohol. The low-viscosity adhesive system can be microdosed, is stable in storage, is completely hardenable and is suitable for applications in which the dimensional tolerances are in the mum and sub-mum region.
申请公布号 EP0912649(A1) 申请公布日期 1999.05.06
申请号 EP19970935433 申请日期 1997.07.17
申请人 SIEMENS AKTIENGESELLSCHAFT 发明人 HOEHN, KLAUS;BAYER, HEINER;HONSBERG-RIEDL, MARTIN
分类号 C08G59/24;C08G59/62;C09J163/00;H01L21/58;(IPC1-7):C09J163/00 主分类号 C08G59/24
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