| 摘要 |
<p>A method of manufacturing liquid crystal on silicon devices uses asymmetric placement of scribes on silicon and glass substrate layers to maximize the yield of processed active matrix silicon wafers. Asymmetrical scribing minimizes a dimension from a gasket seal (600) between the substrates (500) to a lower bond pad edge. An opposite glass overhang provides an interconnect redundancy for an ITO plate (900) or a repair site for electrical contact with the ITO plate. Methods of device separation employing partial sawing are also employed.</p> |
