Method and device for positioning the bonding head of a machine for the bonding of semiconductor chips as a carrier material

摘要

The method involves placing a calibration disk (10) on a supporting surface (6) parallel to a bonding surface (2). A measuring device (7), whose signal depends on the position of the disk, is calibrated. The disk is detected with the bonding head (3), and is held a small distance above the measuring device. The bonding head is adjusted until the signal of the measuring device equals that after its calibration. The method includes the steps of placing a calibration disk (10) with two flat, parallel surface areas (8, 9) on a supporting surface (6) which is arranged parallel to a bonding surface (2), on which semiconductor chips are bonded on the carrier material. A measuring device (7), whose signal depends on the position of the calibration disk, is calibrated. The calibration disk is detected with the bonding head (3), and is held in small distance above the measuring device. The bonding head is adjusted until the signal of the measuring device is equal to the signal of the measuring device after its calibration. An Independent claim is provided for arrangements implementing the method.