| 发明名称 |
Method of handling semiconductor wafers, bars and chips |
| 摘要 |
The invention is a method for handling material which may be in the form of semiconductor wafers, bars, and/or chips. The material is mounted to a flexible film which is heated so as to result in an adhesion strength sufficient to hold the material in place, but low enough so that the material can be removed easily when desired.
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| 申请公布号 |
US5899730(A) |
申请公布日期 |
1999.05.04 |
| 申请号 |
US19970970982 |
申请日期 |
1997.11.14 |
| 申请人 |
LUCENT TECHNOLOGIES INC. |
发明人 |
FREUND, JOSEPH MICHAEL;PRZYBYLEK, GEORGE JOHN;ROMERO, DENNIS MARK;STAYT, JR., JOHN WILLIAM |
| 分类号 |
H01L21/301;H01L21/673;H01L21/68;(IPC1-7):H01L21/301 |
主分类号 |
H01L21/301 |
| 代理机构 |
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