发明名称 |
Mounting device for electronic components |
摘要 |
A device for mounting a first element onto a second element to sandwich an electrical or electronic component therebetween, wherein the device is operable to cause the first element to exert a contact force on the component when the first element is mounted onto the second element and to couple the device to the first element in a manner which exerts a mounting force on the first element which is independent of whether the first element is mounted onto the second element. The first element may be a heat sink and the second element may be a printed circuit board.
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申请公布号 |
US5901039(A) |
申请公布日期 |
1999.05.04 |
申请号 |
US19970895475 |
申请日期 |
1997.07.16 |
申请人 |
BULL S.A. |
发明人 |
DEHAINE, GERARD;STRICOT, YVES |
分类号 |
F16B5/02;H01L23/40;(IPC1-7):H05K7/20 |
主分类号 |
F16B5/02 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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