发明名称 Composition for forming high thermal conductivity polybenzoxazine-based material and method
摘要 The present invention relates to a composition and method for forming a high thermal conductivity polybenzoxazine-based material. The composition comprises at least one benzoxazine resin and a filler material which includes particles of boron nitride in an amount sufficient to establish a thermal conductivity of between about 3 W/mK and 37 W/mK in the polybenzoxazine-based material.
申请公布号 US5900447(A) 申请公布日期 1999.05.04
申请号 US19970846457 申请日期 1997.05.01
申请人 EDISON POLYMER INNOVATION CORPORATION 发明人 ISHIDA, HATSUO
分类号 C08K3/22;C08G14/073;C08G59/40;C08K3/28;C08K3/36;C08K3/38;C08L61/34;(IPC1-7):C08K3/38 主分类号 C08K3/22
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