发明名称 |
Composition for forming high thermal conductivity polybenzoxazine-based material and method |
摘要 |
The present invention relates to a composition and method for forming a high thermal conductivity polybenzoxazine-based material. The composition comprises at least one benzoxazine resin and a filler material which includes particles of boron nitride in an amount sufficient to establish a thermal conductivity of between about 3 W/mK and 37 W/mK in the polybenzoxazine-based material.
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申请公布号 |
US5900447(A) |
申请公布日期 |
1999.05.04 |
申请号 |
US19970846457 |
申请日期 |
1997.05.01 |
申请人 |
EDISON POLYMER INNOVATION CORPORATION |
发明人 |
ISHIDA, HATSUO |
分类号 |
C08K3/22;C08G14/073;C08G59/40;C08K3/28;C08K3/36;C08K3/38;C08L61/34;(IPC1-7):C08K3/38 |
主分类号 |
C08K3/22 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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