发明名称 |
VISUAL INSPECTION SUPPORT APPARATUS, SUBSTRATE INSPECTION APPARATUS, AND SOLDERING INSPECTION AND CORRECTION METHODS USING THE SAME APPARATUS |
摘要 |
An X-stage (21) provided at a front edge of a table (11) is movable along a rail (23) in the direction of an X-axis. The X-stage supports thereon a projector (70) for illuminating an upper surface of a substrate PCB to be inspected, and an image pickup unit (80) for taking a picture of a region illuminated by the projector. An image obtained by the image pickup unit (80) is shown on a display (13). A Y-stage (41) is provided movably along a rail (33) on a base (10). A substrate support member (50) supporting the substrate PCB is joined pivotably at its front end portion to the Y-stage (41). An inspector checks soldered portions while observing the image on the display (13). When a defective solder bond is found, the inspector draws the Y-stage (41) frontward and raises the substrate support member diagonally for a correction. <IMAGE> |
申请公布号 |
KR170542(B1) |
申请公布日期 |
1999.05.01 |
申请号 |
KR19950074542 |
申请日期 |
1995.10.18 |
申请人 |
OMRON CORP. |
发明人 |
KOBAYASHI, SHIGEKI;MIYAKE, TAMIO;TANAKA, KOICHI;YAMAMOTO, NORIHITO;TANIMURA, SHIGERU |
分类号 |
G01R31/28;G01R31/309;H01L21/66;H05K13/08;(IPC1-7):G01B11/24 |
主分类号 |
G01R31/28 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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