CERAMIC BOARD FOR MOLDING OF ELECTRIC OR ELECTRONIC CIRCUIT,申请号KR19910007202-传众专利搜索

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发明名称	CERAMIC BOARD FOR MOLDING OF ELECTRIC OR ELECTRONIC CIRCUIT
摘要
申请公布号	KR173783(B1)	申请公布日期	1999.05.01
申请号	KR19910007202	申请日期	1991.05.02
申请人	MITSUBISHI MATERIALS CORP.	发明人	YOSHIDA, HIDEAKI;TORIUMI, MAKOTO;TANAKA, HIROKAZU;UEMZAWA, MASAO;YUZAWA, MICHIO;KUROMITSU, YOSHIROU
分类号	H01L23/14;H01L21/52;H01L23/36;H05K3/00;(IPC1-7):H05K3/00	主分类号	H01L23/14
代理机构		代理人
主权项
地址

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