| 摘要 |
<p>PROBLEM TO BE SOLVED: To prolong life by suppressing the generation of large thermal stresses in a wafer support being used, when processing a wafer while rotating it at a high temperature. SOLUTION: An inner-periphery side part 11 has an opening part at a center, and a wafer 10 is accommodated in an opening part 14. An outer-periphery side part 12 has an opening part at a center, and the inner-periphery side part 11 is supported in the opening part. A sectional shape that is vertical with respect to the planar thickness direction of the opening part of the outer- periphery side part 12 has a shape, in which circumference is divided equally into four parts and a straight line is inserted into the divided parts. Furthermore, the shape of the section of the planar thickness direction of the opening part of the outer-periphery side part 12 is formed, so that it has a linear inclination and the diameter of the opening part which gradually becomes smaller from the upper surface side toward the lower surface side of the outer-periphery side part 12. The section of the outer-periphery part of the inner-periphery side part 11 has the same shape as the sectional shape of the opening of the outer-periphery side part 12.</p> |
