| 摘要 |
PROBLEM TO BE SOLVED: To provide a low-cost, small and light semiconductor package and manufacture thereof. SOLUTION: This manufacturing method comprises forming a strippable metal layer 12 on a board 11 which is to be a provisional support, provisionally fixing a semiconductor chip 2 to the same surface, connecting wiring pads 5 of the chip to terminals 4 of the metal layer 12 with bonding wires 6, sealing it with a seal resin 9, and stripping the board 11 from the resin 9 so as to expose the metal layer 4 at the terminals and chip 2 on one surface of the resin 9. |
