| 摘要 |
PROBLEM TO BE SOLVED: To improve deformability, heat conductivity, high electrical conductivity and reflow resistance by constituting an epoxy resin contained in an organic binder of a specific rate to metallic powder, on which the surface concentration of silver and gold contained together with copper is higher than the average concentration and which has the specific average particle size, so as to have a glycidyl ether bond not less than bifunctions in a naphthalene skeleton. SOLUTION: The composition of this metallic powder is expressed by MxCu1 - x, and has an average particle size of 2 to 15μm, and is superior in oxidation resistance and electrical conductivity at connecting time, and is close in a thermal expansion coefficient to a connecting object composed mainly of copper. In the formula, M represents Ag or/and Au, and (0.01<=x<=0.6) is realized. Since an organic binder of 1 to 120 pts.wt. contains a naphthalene expoxy resin of a prescribed rate to 1 pts.wt. of the metallic powder, heat resistance and reactivity are improved, and connection failure by stress applied to an end bump at reflow time is reduced. It is satisfactory to include a microcapsule type imidazole derivative at a prescribed rate as a hardening agent to improve preserving time stability.
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