| 摘要 |
PROBLEM TO BE SOLVED: To protect a glass board against cracking, by a method wherein a transparent electrode layer is formed through a patterning method where a laser is not used, and a photoelectric conversion layer and a back electrode layer are formed on the transparent electrode layer through a patterning method where a laser is used. SOLUTION: A transparent conductive film is formed on a glass substrate, and a prescribed pattern is provided to the transparent conductive film through a patterning method where no laser is used. Then, a groove is provided to form the transparent conductive film up to the surface of the glass substrate so as to form a transparent electrode layer. Then, an amorphous silicon layer is formed on the transparent electrode layer and filled into the groove. A groove is provided to the upside of the transparent electrode layer by a patterning method where a laser is used to form a photoelectric conversion layer. Then, a metal layer is formed on the photoelectric conversion layer, and a prescribed pattern is provided to the metal layer through a patterning method where a laser is used for the formation of a back electrode layer. |
