| 摘要 |
PROBLEM TO BE SOLVED: To provide a cooling device, wherein only electronic components are allowed to be attached/detached and if the electronic components are housed in a housing body, the heat is dissipated. SOLUTION: A cooling device comprises a housing body. In the housing body 2, electronic components 7 are detachably housed. A thermal conductive plate 11 where a heat pipe 10 is embedded is fixed to a backboard substrate 2b or a side wall of the housing body, and the thermal conductive plate 11 is provided away from the electronic components 7 while facing it. On such surface of the thermal conductive plate 11 as on the side where the electronic components 7 are provided, a thermal conductive mat 12 is provided. With a mat presser 13 attached to a front end of the thermal conductive plate 11, an end part of the thermal conductive mat 12 is pressurized for a thickness of the thermal conductive mat 12 to be increased in such direction as the electronic components 7 are provided. |
