| 摘要 |
PROBLEM TO BE SOLVED: To make a mounting area small and high-frequency characteristics and heat radiation efficiency satisfactory, by connecting the back surfaces of a die bond pad and a wire bond pad directly to a mother board. SOLUTION: A discrete semiconductor element 8 is fixed onto the surface of a die bond pad 5 of a single-wired substrate 1 through a back electrode. The surface electrode portion of the element 8 is connected to a wire bond pad 6 of the substrate 1 via an Au wire 9. In order to protect the element 8 and the wire 9, an epoxy sealing resin 2 is molded on the top of the substrate 1. The back surfaces of the pads 5 and 6 of a semiconductor device 100 are connected to connection electrodes on a mother board 10 by a solder 11. Since the element 8 is connected directly to the board 10 through the pads 5 and 6 this way, the heat radiation characteristic of the element 8 can be improved. |
