VAPOR DEPOSITING DEVICE

摘要

PROBLEM TO BE SOLVED: To improve the efficiency of operation for forming thin films. SOLUTION: A member 14 to be inserted having a sharp nail is fixed at an end of an upper servo arm 8 of a wafer transporting device 6. A transporting plate 9 on which a wafer is placed is fixed at an end of a lower servo arm 7. A controlling device 15 numerically controls the amount of travel of these two servo arms 7 and 8. After thin films have been formed, the nail of the member 14 to be inserted is slid between a susceptor 2 and a wafer 3 in a reaction chamber by driving the upper servo arm 8. The outer brim of the wafer 3 is lifted from the susceptor 2 by the nail of the member 14 to be inserted. Then the lower servo arm 7 is driven to insert the transporting plate 9 under the wafer 3. The member 14 to be inserted is lowered by driving the upper servo arm 8, and the wafer 3 on the susceptor 2 is transferred onto the transporting plate 9. The transporting plate 9 is transported from the reaction chamber 1 to a cassette chamber 12 by driving the lower servo arm 7.