METHOD AND DEVICE FOR MANUFACTURE OF SEMICONDUCTOR DEVICE

摘要

PROBLEM TO BE SOLVED: To manufacture a semiconductor device with high performance highly precisely by an efficient method. SOLUTION: A semiconductor chip 1 and a semiconductor chip holding part 2 in a lead frame are spaced at a fixed clearance apart. Then, the clearance is charged with adhesive 5. Then, the semiconductor chip 1 is fixed to a lead frame by curing the adhesive 5 simultaneously with wire bonding of the inner lead 6 and an electrode pad in the semiconductor chip 1.