| 摘要 |
PROBLEM TO BE SOLVED: To enhance the mounting reliability of a fine pitched BGA. SOLUTION: This semiconductor device has a structure, which has an external terminal 7 on one face of an electrically insulating substrate 3 having wiring patterns 2, and in which a reverse face of the electrically insulating substrate 3 is adhered to a face having an electrode terminal 8 of a semiconductor element 1. The electrode terminal 8 of the semiconductor element is connected electrically to the wiring patterns 2 of the electrically insulating substrate 3. The external terminal 7 has a structure in which a solder ball is connected to a mounting pad, and an electrically insulating sheet 6 having a through-hole in a solder ball mounting part is adhered to the surroundings of the mounting pad. |
