| 摘要 |
PROBLEM TO BE SOLVED: To improve operation reliability by completely canceling unstable state of an operation initial stage. SOLUTION: In a method for mounting semiconductor components, pressing force from a lifting driving part 2 received by a pusher 1 is transmitted to a pressurizing head 4 through a compression spring 3, and the semiconductor components 50 are mounted on a mounting substrate 5 by curing adhesive, while pressing the semiconductor components 50 on the mounting substrate 5 by elastic restoring force of a compression spring 3. In initial operation of the lifting driving part 2, pressing force from the pusher 1 is transmitted directly to the pressing head 4 and the pressurizing head 4 is lowered forcibly and instability of sliding resistance, while a mechanism sliding part is shifted from statical friction to dynamical friction is eliminated.
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