| 摘要 |
PROBLEM TO BE SOLVED: To provide a method for manufacturing a multilayered printed wiring board having an inter-layer connection structure with high wiring density and connection reliability. SOLUTION: A conductive layer 22 having a terminal 22a is formed on an insulating substrate 21, and an insulating layer 23 is formed to cover the conductive layer 22. A conductive layer 24 having a land 24a is formed on the insulating layer 23, and a photosensitive resin layer 25 is formed so as to cover the conductive layer 24. An insert hole 26a is formed at the photosensitive resin layer 25 by photolithographic method so that an insulating layer 23 as enclose with a part of the land 24a and the land 24a is exposed. With the exposed land 24a as a mask, the exposed insulating layer 23 is irradiated with a laser beam for removal, to form an insert hole 26b. With the insert holes 26a and 26b, a via hole insert hole 26 is constituted. On the photosensitive resin layer 25, a conductor layer having a terminal is formed, while a conductor covering the surface of the insert hole 26 is formed at the same time. |
