| 摘要 |
PROBLEM TO BE SOLVED: To surely conductingly connect semiconductor chips mutually, without spoiling their characteristics. SOLUTION: This semiconductor device having a first semiconductor chip 3 with a first (method bump) terminal 31a and second semiconductor chip 4 having a second (method bump) terminal 40a connected electrically to the first terminal 31a via a conductor (stud bump) 7. The first and second semiconductor chips 3, 4 are bonded mechanically mutually through a resin adhesive 6 which seals terminal-forming (main) planes 3a, 4a of both the chips 3, 4 for mutually connecting the chips. Pref. the first and second terminals 31a, 40a are arranged facing mutually opposite and a conductor, e.g. a compressible deformable stud bump 7 is interposed between these terminals 31a, 40a and at least one of the chips 3, 4 is a ferroelectric memory chip. |
