| 摘要 |
<p>PROBLEM TO BE SOLVED: To provide a semiconductor device, in which when a semiconductor bare chip is mounted to a motherboard via an interposer, positioning is facilitated with high precision, mounting throughput is enhanced, and also connection failures, etc., can be prevented for attaining high reliability. SOLUTION: A downward stepwise projected interposer 20, to which a semiconductor bare chip 10 is mounted as a flip chip, is mounted to a stepwise recessed motherboard 30 having a multilayered wiring structure. Namely, a bottom face having a downward stepwise projected shape of the downward stepwise projected interposer 20 is wholly engaged with an upper face having a stepwise recessed shape of the stepwise recessed motherboard 30. A lower end part of a through-hole wire 26 exposed from the bottom face of the downward stepwise projected interposer 20 is connected to a land 36 exposed to an upper face of the stepwise recessed motherboard 30 with solder or anisotropically conductive resins or by a press contacting.</p> |
