| 摘要 |
PROBLEM TO BE SOLVED: To facilitate the formation of high reliable chip size packages by covering the surfaces and sides of a semiconductor element which has bump electrodes on the surface thereof. SOLUTION: Bump electrodes 2 are formed on a wafer 5 formed of a circuit element. Next, the backside of the wafer 5 is pasted on a scribe ring 8 using a scribe sheet 7, so as to divide the wafer 5 into pieces. Next, the wafer 5 divided into pieces held by the scribe sheet 7 is contained in a mold metallic die 10 to be pressed for making surface levels of the gold bumps 2 uniform. Next, when a resin 12 is poured from a gate 11, the resin 12 is formed in a state with the surface of the bump electrodes 2 exposed. Later, solder balls 4 are mounted on the surface of the bump electrodes 2 so as to divide the wafer 5 with the resin 12 poured into gaps again into individual chips. Through these procedures, the chip size packages with the side of an LSI chip 1 also covered with the resin 12 can be formed easily. |
