发明名称 SEMICONDUCTOR DEVICE AND ITS MANUFACTURE
摘要 <p>PROBLEM TO BE SOLVED: To enhance reliability in a structure, by a method wherein a conductive member between an underlayer wiring and a columnar connection part is integrally formed. SOLUTION: A width of an underlayer wiring 8 is W0 and a plug 7 has a columnar plane which is a trapezium accommodated in this width. A length in an extension direction of the underlay wiring 8 is L0 , a height of the underlayer wiring 8 is Hw, and a height of the plug 7 is Hp. The plug 7 is directed downward in an extension direction of the underlayer wiring 8 in a connection portion with the underlayer wiring 8, namely the plug 7 has a shape enlarged slightly toward a direction of the underaleyr wiring 8, and a length of this enlarged part is L1 , and such a continuous structure is mechanically filmy a connection body, and resistance is not electrically increased. Accordingly, a conductive material comprising the underlay wiring 8 and the plug 7 is simultaneously and integrally formed and connection resistance is not caused, and it is possible to attain preferable electric characteristics and attain a structure having high reliability.</p>
申请公布号 JPH11121612(A) 申请公布日期 1999.04.30
申请号 JP19970280155 申请日期 1997.10.14
申请人 MITSUBISHI ELECTRIC CORP;RYODEN SEMICONDUCTOR SYST ENG CORP 发明人 SHIMA HIROYUKI
分类号 H01L21/768;H01L23/522;(IPC1-7):H01L21/768 主分类号 H01L21/768
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